High-Density Computing Power
High Reliability and Security
Efficient Energy Saving
Intelligent O&M
Main application scenarios:
High performance database (OLAP/OLTP)
Memory database
HPC
High-density virtualization
Main application scenarios
High performance database (OLAP/OLTP)
Memory database
HPC
High-density virtualization
Unparalleled Computing Power
4 x 350 W CPUs and 64 x DDR5 DIMMs in 2U space secure
an industry-leading position
High-Speed Interconnection
50% higher UPI speed for interconnection between CPUs provides better performance; supports PCIe 5.0 and 400 Gbit/s NIC interconnection
Flexible Configuration
Supports PCIe 5.0 and multiple standard PCIe slots
50% Better Heat Dissipation Capability Than a Single Heat Sink
Advanced Extended Volume Air Cooling (EVAC) ensures reliable heat dissipation and stronger temperature adaptation
66% Less System Downtime
Unique AI memory fault self-healing ensures stable system running
Saving Energy by up to 8% Compared with the Industry Average
The unique algorithm is provided for the lowest power consumption of fans and CPUs
Industry-leading Power Supply Technology for Higher Efficiency
Three core technologies improve power and efficiency, enabling the industry-leading power conversion rate and the power loss 12.5% lower than the industry average
Intelligent Service Awareness, Dynamic Load Adjustment
The CPU working frequency is dynamically adjusted based on the actual service load
Intelligent O&M
2U rack server
2 or 4 x 4th Gen Intel® Xeon® Scalable processors with TDP up to 350 W per processor
Emmitsburg PCH
64 x DDR5 DIMMs
Hot-swappable drives configurations:
• 8 x front 2.5″ SAS/SATA drives
• 25 x front 2.5″ SAS/SATA drives
• 4 x front 2.5″ SAS/SATA drives and 8 x NVMe SSDs
Flash storage: 2 x M.2 SSDs, supporting hardware RAID
RAID 0, 1, 10, 1E, 5, 50, 6, or 60; supercapacitors for cache data protection from power failures;
RAID level migration, drive roaming, self-diagnosis, and remote web-based configuration
Multiple network expansion capabilities
1 x OCP 3.0 NIC, supporting hot swap
Up to 10 x PCIe slots, including 1 x FlexIO slot dedicated for the OCP 3.0 NIC and 9 x standard PCIe slots
6 x hot-swappable counter-rotating fans in N+1 redundancy
900 W/1200 W/1500 W/2000 W/3000 W Platinum/Titanium hot-swappable PSUs in 1+1 redundancy
The iBMC chip integrates one dedicated management GE network port, providing comprehensive management features such as fault diagnosis, automatic O&M, and hardware security hardening.
• The iBMC supports standard interfaces such as Redfish, SNMP, and IPMI 2.0, provides a remote management user interface based on HTML5/VNC KVM; supports out-of-band management functions such as monitoring, diagnosis, configuration, Agentless, and remote control for simplified management.
• It is optional to configure the FusionDirector management software that provides advanced management features such as five intelligent technologies, enabling intelligent, automatic, visualized, and refined management throughout the lifecycle.
FusionOS, Microsoft Windows Server, SUSE Linux Enterprise Server, VMware ESXi, Red Hat Enterprise Linux, Oracle, Ubuntu, and openEuler. For more, click here
Power-on password, administrator password, Trusted Platform Module (TPM) 2.0, security bezel, secure boot, and chassis intrusion detection
5°C to 45°C (41°F to 113°F), compliant with ASHRAE Classes A1/A2/A3/A4
CE, UL, CCC, FCC, VCCI, and RoHS
L-shaped guide rails, adjustable guide rails, and holding rails
Chassis with 2.5″ drives: 86.1 mm x 447 mm x 898 mm (3.39 in. x 17.60 in. x 35.35 in.)
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400-080-6888